Articles from Accelsius

Accelsius™, a leader in innovative two-phase, direct-to-chip liquid cooling technology, today announced the launch of NeuGuard, a comprehensive support program designed to provide unmatched cooling reliability in the era of AI and advanced computing.
By Accelsius · Via Business Wire · March 12, 2025

Accelsius™, a leader in innovative two-phase, direct-to-chip liquid cooling technology, today announced its plans to present its advanced cooling solutions at Data Centre World London from March 12-13. The company will showcase its pioneering cooling technology designed to enhance AI data center performance and efficiency.
By Accelsius · Via Business Wire · March 4, 2025

Accelsius™, a leader in innovative two-phase, direct-to-chip cooling technology, today announced a strategic partnership with Nordik Data Centers to build a next-generation AI data center near Montreal. The project features a co-innovation lab where customers can validate performance metrics and efficiency gains of Accelsius' cooling technology in real-world conditions.
By Accelsius · Via Business Wire · February 11, 2025

Accelsius™, a leader in innovative two-phase, direct-to-chip cooling technology, today announced the promotion of Liz Cruz to Chief Marketing Officer. Cruz previously served as Senior Director of Product Marketing and Business Development and has been instrumental in driving the company’s product marketing strategy and market expansion.
By Accelsius · Via Business Wire · January 28, 2025

Accelsius™, a leader in innovative two-phase, direct-to-chip cooling technology, and iM Data Centers, a leader in advanced manufacturing of high-performance modular data centers with expertise in transforming legacy facilities into sustainable, high-performance computing (HPC) data centers, today announced a strategic partnership to deliver sustainable, scalable data center cooling solutions. This collaboration will support the growing demand for HPC and AI workloads initially at iM’s Miami data center, set to open in Q1 2025.
By Accelsius · Via Business Wire · November 19, 2024

Accelsius™, whose proprietary two-phase, direct-to-chip liquid cooling systems enable high-performance computing and rack density for data center and edge operators, announced today the successful raise of $24 million pursuant to a Series A funding round. The Series A funding round started in early 2024.
By Accelsius · Via Business Wire · November 13, 2024

Accelsius™, whose patented two-phase, direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge operators, today announced its plans to showcase advanced cooling solutions at the 2024 OCP Global Summit in San Jose, California, from Oct. 15-17. The company will present research findings and demonstrate innovative technologies aimed at helping organizations dramatically improve data center performance and efficiency.
By Accelsius · Via Business Wire · October 10, 2024

Accelsius™, whose patented two-phase, direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge operators, today announced the commercial availability of its Thermal Simulation Rack (TSR), featuring integrated Load Simulation Sleds (LSS). This advanced system allows data centers, ecosystem partners and technology providers to test and validate Accelsius’ advanced NeuCoolTM two-phase, direct-to-chip liquid cooling solutions without requiring multi-million-dollar investments in AI and HPC hardware.
By Accelsius · Via Business Wire · October 8, 2024

Accelsius™, whose patented two-phase, direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge operators, announced today its speaking engagement at an invitation-only event hosted by Digital Infrastructure Network (DIN) in London on June 18.
By Accelsius · Via Business Wire · June 13, 2024

Accelsius™, whose patented two-phase direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge computer operators, announced today it was selected as one of Austin Business Journal's 2024 Best Places to Work.
By Accelsius · Via Business Wire · April 16, 2024

Data Center World 2024-- Accelsius™, whose patented two-phase direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge computer operators, today announced NeuCool™, its in-rack solution that delivers unmatched thermal performance.
By Accelsius · Via Business Wire · April 15, 2024

Accelsius™, whose patented NeuCool™ 2-Phase DTC liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge computer operators, today announced a strategic partnership with OptiCool® Technologies and their active RDHx Cool Door® to accelerate the creation of waterless, direct-to-chip liquid cooling systems to serve a rapidly expanding market.
By Accelsius · Via Business Wire · April 2, 2024

Accelsius™, whose patented direct-to-chip liquid cooling systems enable unprecedented, high-performance computing and compute density for data center and edge computer operators, today announced a strategic partnership with Equus Compute Solutions (ECS) to help meet the demand from data centers for advanced, innovative liquid cooling solutions.
By Accelsius · Via Business Wire · March 20, 2024

Accelsius™, an Austin-based company with a patented two-phase, direct-to-chip, liquid cooling system, today announced a partnership with the Texas Advanced Computing Center (TACC), the leading advanced computing research facility at The University of Texas at Austin. TACC is a strategic proof-of-concept customer of Accelsius’ Kickstart program and the first world-renowned supercomputing facility to use a two-phase, direct-to-chip liquid cooling system.
By Accelsius · Via Business Wire · March 13, 2024

Accelsius™, whose patented direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge compute operators, today announced its Accelerate Partner Program. This new strategic initiative aims to increase the momentum of qualified solution providers in the rapidly growing liquid cooling market.
By Accelsius · Via Business Wire · January 18, 2024

Accelsius™, whose patented two-phase, direct-to-chip liquid cooling systems enable unprecedented, enterprise-class compute density for data center and edge operators, today announced the launch of its Kickstart program, an exclusive field trial of the company’s innovative NeuCool™ platform.
By Accelsius · Via Business Wire · December 6, 2023

Accelsius™, whose patented direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge computer operators, today announced the opening of its new corporate headquarters in Austin, Texas.
By Accelsius · Via Business Wire · August 8, 2023