Articles from Yield Engineering Systems

Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, today announced orders of multiple VertaCure™ G3 curing systems from one of Asia’s top foundries. These systems will support advanced packaging processes for AI and HPC solutions, delivering critical low-temperature curing, annealing, and degassing.

Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, today announced the delivery of multiple VertaCure™ LX curing systems to one of Taiwan’s top outsourced semiconductor assembly and test (OSAT) providers. These systems will support advanced packaging processes for Edge Computing and HPC solutions, delivering critical low-temperature curing, annealing, and degassing for WLCSP, Plated Bump, and Cu Pillar applications.